WaferExport provides the best Silicon Nitride Wafers. Silicon Nitride Si3N4 is characterized by high creep, oxidation and high temperature resistance and also low coefficients of thermal expansion. This is related to the good resistence to thermal shocks.
Basically we offer SI3N4 in three varietes: Hot Pressed Silicon Nitride (HPSN), Reaction Bonded Silicon Nitride (RBSN) and Sintered Silicon Nitride (SSN).
Finally low Stress Silicon Nitride layer can be deposited using two methods:
- LPCVD (Low Pressure Chemical Vapor Deposition) – coatings are characterized by low thermal conductivity, cleanliness and repeatability of deposition.
- PECVD (Plasma-Enhanced Chemical Vapor Deposition) – coatings are growing faster, but there are thicker in comparison to LPCVD method.
|Thickness range||up to 1.3 µm|
|Surface finishing||double/single sided polishing|
|Types||standard and low stress|