Silicon Wafer Etching Services
Etching is the process of dissolving wafer surfaces. It includes solutions or mixtures to attack the wafer surface during manufacturing.
This technique is intended to eliminate metal films, layers on the surface, contamination created during grinding or stress after lapping process.
We can extinguish a few types of etching:
- wet etching – using liquid phase
- anisotropic wet etching
- plasma etching – using plasma phase “dry etching”