Wafer Bonding Services
Bonding is used to join several substrates, or wafers (such as silicon). Bonding can be accomplished using an organic or mineral adhesive or without an adhesive (direct bonding). Depending on what it is being used for, bonding can be temporary or permanent.
- Firstly the substrate´s surface is cleaned.
- An organic, insulating and also metal layer can be deposited.
- At the end the substrates are joined together using pressure (for indirect bonding or under pressure)
Generally bonding is used to make innovative substrates and electronic and micromechanical components.
Direct bonding, which does not use adhesive, ensures that the components will be resistant to high temperatures and provides better interfaces.
Finally we can distinguish two types of bonding :
- wafer on insulator (it is possible to eliminate the air bubbles produced during the bonding)
- wafer – wafer
|Device Layer Thickness Ranges||> 300µm, 20 – 299µm, 2 – 19µm|
|Target Handle Layer Thickness Ranges||SEMI Standard, > 300µm, 100 – 299µm|
|Diameter||100 – 300mm|
|Device Layer Tolerance||10.5µm|
|Box Thickness Ranges||0.1 – 0.9µm, 1 – 2µm|