Wafer Grinding Service

Wafer Grinding Service

Grinding is a finishing process of the surface by abrasive tools, which results in high dimensional accuracy, shape and low roughness. Machines for this type of processing are called grinders and cutting tools – grinding wheels. The material from which grinding wheels are made is most commonly corundum, diamond, silicon carbide or boron carbide.

Grinding Capabilities

Diameter 100 – 300mm
TTV As low as 2µm (before polishing)
Thickness Can grind wafers as thin as 50µm

More services we offer : Polishing, Etching, Dicing, Crystal Growth, Bonding.