Wafer Grinding Service
Grinding is a finishing process of the surface by abrasive tools, which results in high dimensional accuracy, shape and low roughness. Machines for this type of processing are called grinders and cutting tools – grinding wheels. The material from which grinding wheels are made is most commonly corundum, diamond, silicon carbide or boron carbide.
| Diameter | 100 – 300mm |
| TTV | As low as 2µm (before polishing) |
| Thickness | Can grind wafers as thin as 50µm |
More services we offer : Polishing, Etching, Dicing, Crystal Growth, Bonding.