wafer polishing

WaferExport offers polishing services for wafers, just after they are manufactured.

This is a finishing treatment that aims to achieve the desired smoothness and gloss of the surface of the polished wafer.

Polishing is usually done with soft (felt) discs and abrasives (eg polishing pastes) or by electrochemical methods.

Depending on the wishes of the customer, we provide one-sided or double-sided polishing wafer services.

Polishing Specifications

Surface Roughness < 5E
TTV < 5µm
Minimum Polishing Range 225 – 250µm
Maximum Polishing Range 1500µm

More services : Grinding, Dicing, Crystal Growth, Etching, Bonding.