WaferExport offers polishing services for wafers, just after they are manufactured.
This is a finishing treatment that aims to achieve the desired smoothness and gloss of the surface of the polished wafer.
Polishing is usually done with soft (felt) discs and abrasives (eg polishing pastes) or by electrochemical methods.
Depending on the wishes of the customer, we provide one-sided or double-sided polishing wafer services.
| Surface Roughness | < 5E |
| TTV | < 5µm |
| Minimum Polishing Range | 225 – 250µm |
| Maximum Polishing Range | 1500µm |
More services : Grinding, Dicing, Crystal Growth, Etching, Bonding.