WaferExport offers wafer polishing services, just after they are manufactured.
This is a finishing treatment that aims to achieve the desired smoothness and gloss of the surface of the polished wafer.
During the lamination and grinding processes, wafers’ surfaces get damaged, not in a serious irreversible way, but some irregular relief that goes from 5 to 10 μm. As smooth as this may seem, some of the wafer’s applications may be in jeopardy due to this irregular relief. To correct this issue the polishing process takes place, being the Chemical Mechanical Polishing (CMP) the most common technique.
CMP uses both chemical products, just as a chemical etching would do, and mechanical forces, with soft (felt) discs and abrasives (eg polishing pastes).
Depending on the wishes of the customer, we provide one-sided or double-sided polishing wafer services.
Wafer Polishing Specifications
| Surface Roughness | < 5E |
| TTV | < 5µm |
| Minimum Polishing Range | 225 – 250µm |
| Maximum Polishing Range | 1500µm |
Contact us to get a personalized quotation according to your needs. Should you need any further information, please do not hesitate to contact us too via email info@photonexport.com or by phone (toll free) in Spain +34 622 375 955, Portugal +351 800 180 183 or France +33 805 080 082.
More services : Grinding, Dicing, Crystal Growth, Etching, Bonding.