Silicon Wafer Dicing Services

WaferExport offers a wide range of services including dicing.

This technique involves separating the wafer die from the semiconductor during production. The die can range from 35 mm to 0.1 mm square. In this process we can distiguished breaking, sawing, scribing and laser cutting. Once the wafers have been cut into small chips, they can be used in the electronics industry, such as cell phones, computers and a lot of other devices.

More services we offer : Polishing, Grinding, Etching, Crystal Growth, Bonding.